IPC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
Product Details
- Published:
- 03/01/2018
- Number of Pages:
- 32
- File Size:
- 1 file , 2.4 MB
- Product Code(s):
- J033-STD-0-D-0-EN-D, J033-STD-0-D-0-EN-D
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
