IPC J-STD-006 Revision B
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
| Published by | Publication Date | Number of Pages |
| IPC | 01/01/2006 | 30 |
IPC J-STD-006B – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ”special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
Product Details
- Published:
- 01/01/2006
- Number of Pages:
- 30
- File Size:
- 1 file , 130 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
